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Tadashi Iida

USPTO Granted Patents = 7 (Patent Applications = 1)

Average Co-Inventor Count = 6.2

ph-index = 4

Forward Citations = 56(Granted Patents)

Location History:

Isehara, JP (1998 - 1999)
Atsugi, JP (2004 - 2007)

Company Filing History:

7 out of 42,496

Years Active: 1998-2007

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7 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7169216 - Electroless copper plating solution, electroless copper plating process and production process of circuit board (2007-01-30),

2. 6989329 - Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections (2006-01-24),

3. 6900394 - Electroless copper plating machine, and multi-layer printed wiring board (2005-05-31),

4. 6831009 - Wiring substrate and an electroless copper plating solution for providing interlayer connections (2004-12-14),

5. 6805915 - Electroless copper plating solution, electroless copper plating process and production process of circuit board (2004-10-19),

6. 5930382 - Wiring pattern inspecting method and system for carrying out the same (1999-07-27),

7. 5754621 - X-ray inspection method and apparatus, prepreg inspecting method, and (1998-05-19),

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