This inventor holds 7 USPTO granted patents and 1 published patent application. Top assignee: Hitachi, Ltd.. Active years: 1998-2007.
Location History:
- Isehara, JP (1998 - 1999)
- Atsugi, JP (2004 - 2007)
Company Filing History:
Years Active: 1998-2007
Title: Innovations of Tadashi Iida in Electroless Copper Plating
Introduction
Tadashi Iida is a notable inventor based in Atsugi, Japan. He has made significant contributions to the field of electroless copper plating, holding a total of 7 patents. His work focuses on improving the stability and efficiency of copper plating solutions used in various applications.
Latest Patents
Iida's latest patents include an electroless copper plating solution and a process for producing circuit boards. One of his key innovations is an electroless copper plating solution that utilizes glyoxylic acid as a reducing agent. This solution minimizes the precipitation of salts during the plating reaction, allowing for stable use over extended periods. The formulation includes copper ions, a complexing agent, a reducing agent, and a pH adjusting agent, specifically potassium hydroxide. Additionally, it contains various additives to enhance its performance.
Another significant patent involves a method for manufacturing a multilayer wiring substrate. This process ensures high connection reliability by forming openings in a dielectric layer and applying uniform copper plating. The electroless copper plating solution used in this method incorporates mandelonitrile and triethyltetramine, among other components, to achieve the desired results.
Career Highlights
Tadashi Iida is associated with Hitachi, Ltd., where he has contributed to advancements in electroless copper plating technologies. His expertise has led to innovations that are crucial for the production of reliable electronic components.
Collaborations
Iida has worked alongside notable colleagues such as Takeyuki Itabashi and Naoki Nishimura. Their collaborative efforts have furthered the development of effective plating solutions and manufacturing processes.
Conclusion
Tadashi Iida's contributions to electroless copper plating have significantly impacted the electronics industry. His innovative solutions and patents demonstrate his commitment to advancing technology in this field.