The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
Oct. 04, 2000
Takeyuki Itabashi, Hitachi, JP;
Haruo Akahoshi, Hitachi, JP;
Tadashi Iida, Atsugi, JP;
Yoshinori Ueda, Hadano, JP;
Eiji Takai, Yokohama, JP;
Naoki Nishimura, Yokohama, JP;
Takeyuki Itabashi, Hitachi, JP;
Haruo Akahoshi, Hitachi, JP;
Tadashi Iida, Atsugi, JP;
Yoshinori Ueda, Hadano, JP;
Eiji Takai, Yokohama, JP;
Naoki Nishimura, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and keeping a constant salt concentration in the electroless copper plating solution during plating. The electroless copper plating method uses a plating solution containing copper sulfate as copper ion sources, and a copper ion complexing agent as copper ion sources, glyoxylic acid as a copper ion reducing agent, and a pH conditioner. The method is characterized by precipitating and removing sulfuric and oxalic ions in said electroless copper plating solution and keeping an optimum concentration of at least one of sulfuric and oxalic ions in said electroless copper plating solution during plating.