Tadanori Egawa

Title: Tadanori Egawa: Innovator in Polishing Technology

Introduction

Tadanori Egawa is a notable inventor based in Kanagawa-ken, Japan. He has made significant contributions to the field of polishing technology, holding two patents that showcase his innovative approach to improving polishing apparatuses.

Latest Patents

Egawa's latest patents include a polishing apparatus that comprises a polishing tool, a substrate holding member, and a sensor for detecting a failure of a substrate to be polished. Another patent discloses a polishing apparatus that includes a polishing tool, a substrate holding member, a measuring device to measure a drive current of a drive unit, and a failure detection unit. This failure detection unit is designed to identify either the jumping of the substrate from the substrate member or the breakage of the substrate during the polishing operation. The detection is based on comparisons of the drive current with a threshold value or a predetermined waveform pattern.

Career Highlights

Throughout his career, Tadanori Egawa has worked with Ebara Corporation, where he has likely contributed to advancements in polishing technology. His work has been instrumental in enhancing the efficiency and reliability of polishing processes.

Collaborations

Egawa has collaborated with notable coworkers such as Koji Ono and Shozo Oguri, contributing to a dynamic exchange of ideas and innovations in their field.

Conclusion

Tadanori Egawa's contributions to polishing technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively.