Tokyo, Japan

Tadahisa Akita

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Kaijo Corporation. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tadahisa Akita. Retrieved from https://idiyas.com/inventor/tadahisa-akita

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: The Innovations of Tadahisa Akita

Introduction

Tadahisa Akita is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances wire bonding methods in semiconductor devices.

Latest Patents

One of Akita's notable patents is titled "Wire loop, semiconductor device having same and wire bonding method." This invention involves a wire loop that connects a first bonding point and a second bonding point. An additional wire loop is formed after wire bonding at the second bonding point without cutting the wire. This additional wire loop is bonded to the second bonding point or to the vicinity thereof while part of the wire is crushed. This innovative approach improves the efficiency and reliability of semiconductor devices.

Career Highlights

Tadahisa Akita is currently employed at Kaijo Corporation, where he continues to work on advancements in semiconductor technology. His expertise and innovative mindset have made him a valuable asset to the company. With a total of 1 patent, Akita's contributions are recognized within the industry.

Collaborations

Throughout his career, Akita has collaborated with talented individuals such as Mizuho Shirato and Hiromi Fujisawa. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Tadahisa Akita's work in semiconductor technology exemplifies the spirit of innovation. His patent on wire bonding methods showcases his ability to solve complex problems in the field. As he continues to develop new technologies, Akita remains a key figure in advancing semiconductor solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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