The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
May. 10, 2005
Applicants:
Mizuho Shirato, Tokyo, JP;
Hiromi Fujisawa, Tokyo, JP;
Tadahisa Akita, Tokyo, JP;
Inventors:
Assignee:
Kaijo Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/06 (2006.01); B23K 20/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wire loop includes a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed after wire bonding at the second bonding point without cutting the wire and the additional wire loop is bonded to the second bonding point or to the vicinity thereof while part of the wire is crushed.
Shirato, Mizuho. (2011). Wire loop, semiconductor device having same and wire bonding method (U.S. Patent No. 8016182). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8016182
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile