Company Filing History:
Years Active: 2000-2001
Title: The Innovative Contributions of Ta-Cheng Chou
Introduction
Ta-Cheng Chou is a notable inventor based in Hsinchu, Taiwan. He has made significant advancements in the field of semiconductor technology through his innovative methods aimed at enhancing the reliability and performance of bonding pads. With a total of two patents to his name, Chou's work is at the forefront of addressing pressing challenges in semiconductor manufacturing.
Latest Patents
Among his latest patents is a groundbreaking technique titled "Method of Mending Erosion of Bonding Pad." This method involves a meticulous process where a passivation layer and a polyimide layer are formed on a wafer to provide cover for a bonding pad. The polyimide layer is strategically patterned to reveal a portion of the passivation layer. This configuration allows the polyimide layer to serve as an effective mask for etching the passivation layer, ultimately exposing the bonding pad. Notably, the bond pad can deteriorate due to etchant residue left on it, prompting the need for a subsequent formation of an oxide layer to avert further erosion.
Another significant contribution by Chou is his patent for "Surface Treatment for Bonding Pad." This process entails the formation of a passivation layer over the bonding pad, while an opening is created within the passivation layer through a plasma etching process. During this procedure, the bonding pad is subjected to corrosion by the etching plasma containing fluorine. To mitigate the effects of this corrosion, the bonding pad is rinsed with deionized water that includes carbon dioxide, representing a thoughtful approach to preserving the integrity of the bonding pad.
Career Highlights
Throughout his career, Ta-Cheng Chou has worked with prominent companies in the semiconductor industry, including United Semiconductor Corporation and United Microelectronics Corporation. His experience in these organizations has bolstered his expertise and contributed to his innovative endeavors.
Collaborations
Chou has collaborated with esteemed colleagues such as Chia-Chieh Yu and Wen-Pin Kuo. These partnerships have played a vital role in fostering innovation and advancing research in the field of semiconductor technology, enhancing the collective impact of their work.
Conclusion
Ta-Cheng Chou's contributions to the field of semiconductor technology through his patents and collaborative efforts are commendable. His innovative methods for treating bonding pads showcase the importance of addressing challenges in electronic manufacturing. As technology continues to advance, inventors like Ta-Cheng Chou will remain pivotal in ensuring the reliability and performance of semiconductor devices.