This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Texas Instruments Corporation. Active years: 2006.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2006
Title: T T Chiu and Radiant-Heating Flip-Chip Assembly.
Introduction
T T Chiu is an inventor associated with Tucheng, Taiwan, and Texas Instruments Corporation. His recorded patent work addresses a method for assembling flip-chip semiconductor devices using radiant heating.
Latest Patents
Chiu is credited with 1 patent: “Method and Apparatus for Flip Chip Device Assembly by Radiant Heating.” The invention uses infrared energy absorbed by the chip to heat a rapidly thermosetting adhesive, allowing it to flow before solidifying from the center outward. This process secures the chip to the substrate while providing a void-free underfill, and it can accommodate different bump and substrate materials. Its rapid assembly method uses a simple infrared exposure apparatus and is suited to automated in-line manufacturing, including reel-to-reel processes.
Career Highlights
Chiu’s documented patent highlights an approach to flip-chip assembly that combines component attachment and underfill in a single process. The method’s rapid heating and compatibility with automated production are central features of the invention.
Collaborations
The supplied information identifies Jimmy Liang and Kevin Jin as Chiu’s coworkers. It does not specify their roles in the patent or the invention.
Conclusion
T T Chiu’s recorded invention applies radiant heating to make flip-chip assembly faster and more adaptable to automated semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile