The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Dec. 02, 2003
Jimmy Liang, Taipei, TW;
Kevin Jin, Hsin-Tien, TW;
T. T. Chiu, Tu Cheng, TW;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A flip chip semiconductor device having non-solder contact terminals is assembled by securing the chip and substrate with a rapidly thermosetting adhesive. The process is amenable to various bump and substrate materials, and has the advantage of simultaneously adhering the components and of providing a void free underfill. The process makes use of absorption of infrared energy by the chip to heat the adhesive and cause it to flow prior to rapidly solidifying from the center outwardly. The rapid assembly, using a simple infrared exposure apparatus is compatible with reel to reel, or other highly automated in-line processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile