Saint-Ismier, France

Sèbastien Kerdiles


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2007

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2 patents (USPTO):Explore Patents

Title: Sèbastien Kerdiles: Innovator in Semiconductor Technology

Introduction

Sèbastien Kerdiles is a notable inventor based in Saint-Ismier, France. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to material bonding and component fabrication.

Latest Patents

Kerdiles' latest patents focus on multifunctional metallic bonding. These methods provide a way to produce a transfer layer of semiconductor material on a final substrate. In some embodiments, the transfer layer is created by forming a layer of semiconductor material on an initial support. This layer is then assembled with a final substrate through metal bonding. The initial support is mechanically separated from the layer at a weak interface, allowing for the creation of an intermediate substrate. This substrate can be utilized to fabricate various components, such as light-emitting diodes or laser diodes. The techniques developed by Kerdiles enable the production of a transfer layer on a final substrate while also allowing for the recycling of the initial support through a non-destructive mechanical release.

Career Highlights

Throughout his career, Sèbastien Kerdiles has worked with prominent organizations, including the Commissariat à l'Énergie Atomique (CEA) and SOITEC Silicon on Insulator Technologies. His experience in these companies has contributed to his expertise in semiconductor technologies and innovations.

Collaborations

Kerdiles has collaborated with several professionals in his field, including Fabrice Letertre and Christophe Morales. These collaborations have likely enriched his work and contributed to the advancements in semiconductor technology.

Conclusion

Sèbastien Kerdiles is a distinguished inventor whose work in semiconductor technology has led to innovative methods for material bonding and component fabrication. His contributions continue to influence the field and pave the way for future advancements.

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