Saitama, Japan

Syunji Aoki

This inventor holds 1 USPTO granted patent. Top assignee: Sony Corporation. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Syunji Aoki. Retrieved from https://idiyas.com/inventor/syunji-aoki

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 17.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Syunji Aoki: Innovator in Electronics Packaging

Introduction

Syunji Aoki is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of electronics packaging, particularly through his innovative patent that enhances the efficiency of electronic device mounting systems.

Latest Patents

Aoki holds a patent for a "System for mounting electronic device." This electronics packaging system includes a printer, a placing unit, and a reflow unit. The system allows a printed wiring board to be carried in an upright position while having solder printed on all the lands simultaneously. Electronic parts are placed on the lands at the same time and soldered concurrently, resulting in a more compact design and reduced packaging time.

Career Highlights

Syunji Aoki is currently employed at Sony Corporation, where he continues to develop innovative solutions in electronics. His work has been instrumental in advancing the efficiency of electronic device manufacturing.

Collaborations

Aoki has collaborated with notable coworkers, including Kazuhisa Mochida and Katsumi Togasaki, contributing to various projects within the company.

Conclusion

Syunji Aoki's contributions to electronics packaging through his innovative patent demonstrate his commitment to enhancing manufacturing efficiency. His work at Sony Corporation continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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