Hyogo, Japan

Syuichi Osaka

This inventor holds 2 USPTO granted patents. Top assignee: Mitsubishi Denki Kabushiki Kaisha. Active years: 1989-1990.


% Patents Active = 100.0

Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 26(Granted Patents)


Location History:

  • Itami, JP (1989)
  • Hyogo, JP (1990)

Company Filing History:


Years Active: 1989-1990

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2 patents (USPTO):Explore Patents

Title: Syuichi Osaka: Innovator in Semiconductor Technology

Introduction

Syuichi Osaka is a prominent inventor based in Hyogo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of Syuichi Osaka's latest patents is a semiconductor device with a bonding pad. This innovative device comprises a semiconductor substrate, a metal silicide film, a silicon dioxide film, a metal nitride film, and an aluminum film. The silicon dioxide film features an opening corresponding to the bonding pad, while the metal silicide film is formed in this area on the semiconductor substrate. The metal nitride film adheres to the metal silicide film, and the aluminum film serves as the bonding pad. The manufacturing method involves forming and patterning the metal silicide film on the semiconductor substrate, followed by the formation of the silicon dioxide film and the opening. The metal nitride film is then created in the opening, and finally, the aluminum film is applied on top.

Another notable patent is a die bonding apparatus. This apparatus includes a stocker for temporarily accommodating dice, a first conveying device for picking up multiple dice from a wafer, and a wafer loader/unloader for replacing the wafer with a new one. Additionally, it features a bonding station for attaching a die to a work that acts as a die mounting medium, a work loader for supplying works to the bonding station, and a second conveying device for conveying the dice from the stocker to the bonding station.

Career Highlights

Syuichi Osaka is associated with Mitsubishi Denki Kabushiki Kaisha, a leading company in the electronics and semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor devices, contributing to the company's reputation for innovation.

Collaborations

Syuichi has collaborated with notable coworkers, including Ryuichiro Mori and Hisao Masuda. Their combined expertise has fostered a productive environment for innovation and development in semiconductor technology.

Conclusion

Syuichi Osaka's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor devices, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
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