Company Filing History:
Years Active: 2023
Title: The Innovative Work of Sylvia Sutiono in Electronic Component Bonding
Introduction
Sylvia Sutiono, an inventive mind based in Singapore, has made significant contributions to the field of electronics through her innovative patent. With a focus on enhancing the connection of electronic components, Sylvia's work embodies creativity and technical expertise.
Latest Patents
Sylvia holds a patent for a novel process aimed at electrically connecting contact surfaces of electronic components. This process introduces a method of capillary wedge bonding, utilizing a round wire that ranges from 8 to 80 micrometers in diameter. The patent details a technique that involves forming a wire loop and stitch bonding the wire to the contact surfaces of two electronic components. Notably, the wire used consists of a silver or silver-based core, featuring a double-layered coating comprised of a thin inner layer of nickel or palladium and a thicker outer layer of gold, which ranges from 5 to 200 nanometers in thickness. This innovative bonding technique is set to enhance the reliability and efficiency of electronic connections.
Career Highlights
Currently, Sylvia is employed at Heraeus Materials Singapore Pte. Ltd., where she plays a vital role in advancing material technologies within the electronics sector. Her patent reflects her dedication to pushing the boundaries of innovation in electronic components, setting her apart as a key figure in her field.
Collaborations
Throughout her career, Sylvia has collaborated with talented colleagues such as Yean Mee Pun and Murali Sarangapani. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies and the sharing of innovative ideas.
Conclusion
Sylvia Sutiono's contributions to the field of electronics through her innovative patent demonstrate the vital role of inventors in driving technological advancement. Her work not only highlights her expertise but also sets a precedent for future innovations in the industry. As technology evolves, Sylvia's dedication to enhancing electronic component bonding will continue to inspire future inventors and researchers.