Heraeus Materials Singapore Pte. Ltd.

Sylvia Sutiono

Murali Sarangapani

Xi Zhang

Chee Wei Tok

Il Tae Kang

Abito Danila Bayaras

Yean Mee Pun

Kim Hui Chong

Tae Yeop James Kim

A process for electrically connecting contact surfaces of electronic components by capillary wedge bonding a round wire of 8 to 80 &#x3bc;m to the contact surface of a first electronic component, forming a wire loop, and stitch bonding the wire to the contact surface of a second electronic component, wherein the wire comprises a wire core having a silver or silver-based wire core with a double-layered coating comprised of a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.

Process for electrically connecting contact surfaces of electronic components

Growing community of inventors

Singapore, Singapore

Sylvia Sutiono