The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Dec. 12, 2018
Heraeus Materials Singapore Pte. Ltd., Singapore, SG;
Yean Mee Pun, Singapore, SG;
Murali Sarangapani, Singapore, SG;
Xi Zhang, Singapore, SG;
Il Tae Kang, Incheon, KR;
Abito Danila Bayaras, Singapore, SG;
Kim Hui Chong, Singapore, SG;
Sylvia Sutiono, Singapore, SG;
Chee Wei Tok, Singapore, SG;
Tae Yeop James Kim, Gyeonggi-Do, SG;
HERAEUS MATERIALS SINGAPORE PTE. LTD., Singapore, SG;
Abstract
A process for electrically connecting contact surfaces of electronic components by capillary wedge bonding a round wire of 8 to 80 μm to the contact surface of a first electronic component, forming a wire loop, and stitch bonding the wire to the contact surface of a second electronic component, wherein the wire comprises a wire core having a silver or silver-based wire core with a double-layered coating comprised of a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.