Singapore, Singapore

Tae Yeop James Kim


Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: An Insight into Inventor Tae Yeop James Kim

Introduction

Tae Yeop James Kim is a notable inventor based in Singapore, recognized for his innovative contributions to the field of electronic components. With a focus on enhancing the efficiency of electrical connections, his work exemplifies the cutting-edge advancements in technology today.

Latest Patents

Tae Yeop James Kim holds a significant patent titled "Process for electrically connecting contact surfaces of electronic components." This innovative process involves capillary wedge bonding a round wire, ranging from 8 to 80 micrometers, to the contact surfaces of various electronic components. The method not only forms a wire loop but also incorporates stitch bonding to establish a robust connection between components. The wire utilized in this process comprises a silver or silver-based core, encapsulated in a double-layered coating. The inner layer, which is 1 to 50 nm thick, is composed of nickel or palladium, while the outer layer, measuring 5 to 200 nm thick, is made of gold. This design enhances durability and conductivity, making it a valuable innovation in electronics.

Career Highlights

Currently, Tae Yeop James Kim is employed at Heraeus Materials Singapore Pte. Ltd., where he applies his expertise in material science and engineering. His dedication to innovation shines through in his work, as he focuses on developing practical solutions that cater to modern technological needs.

Collaborations

Throughout his career, Tae Yeop James Kim has collaborated with esteemed colleagues Yean Mee Pun and Murali Sarangapani. Their collective expertise and commitment to innovation foster a dynamic environment that encourages the development of groundbreaking technologies in their field.

Conclusion

Tae Yeop James Kim represents the forefront of innovation in the electrical engineering sector. With his substantial patent and contributions to Heraeus Materials Singapore Pte. Ltd., he continues to shape the future of electronic component connectivity. His collaborative efforts further highlight the importance of teamwork in driving progress and fostering innovation.

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