Singapore, Singapore

Yean Mee Pun

USPTO Granted Patents = 1 

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Inventor Yean Mee Pun: Pioneering Innovations in Electronic Component Connectivity

Introduction

Yean Mee Pun is an accomplished inventor based in Singapore, known for her groundbreaking contributions to the field of electronic components. With one registered patent, she stands out for her innovative approach to improving the connectivity of electronic components, making significant strides in technology.

Latest Patents

Yean Mee Pun holds a patent for a process designed to electrically connect contact surfaces of electronic components. This innovative method utilizes capillary wedge bonding to attach a round wire, ranging from 8 to 80 micrometers, to the contact surface of a primary electronic component. The invention further incorporates a wire loop and stitch bonding to connect the wire to a second component. Notably, the wire features a core composed of silver or silver-based material, enhanced by a double-layered coating. The inner layer consists of nickel or palladium, measuring 1 to 50 nanometers thick, while the outer layer is made of gold and measures 5 to 200 nanometers thick.

Career Highlights

Yean Mee Pun is currently employed at Heraeus Materials Singapore Pte. Ltd., a company known for its innovative solutions in materials science. Throughout her career, she has demonstrated a commitment to advancing technology and enhancing the efficiency of electronic components.

Collaborations

During her tenure at Heraeus Materials Singapore Pte. Ltd., Yean has collaborated with talented colleagues such as Murali Sarangapani and Xi Zhang. This teamwork has fostered an environment of innovation, allowing them to push the boundaries of what's possible in electronic manufacturing and connectivity.

Conclusion

Yean Mee Pun's contributions to the field of electronic components reflect her dedication to innovation and technology. Through her patented process, she has set a precedent for future advancements in connectivity, showcasing the potential for even greater achievements in the industry. Her work not only enhances the functionality of electronic components but also inspires the next generation of inventors and engineers.

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