Company Filing History:
Years Active: 2020
Title: Syin Hsu: Innovator in Chemical Mechanical Polishing
Introduction: Syin Hsu is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of chemical mechanical polishing, particularly in processes involving tungsten substrates. His innovative approach has led to advancements that are crucial for the semiconductor industry.
Latest Patents: Syin Hsu holds a patent for a "Chemical mechanical polishing method for tungsten." This process is designed to reduce dishing of tungsten features that are 100 micrometers or less. The method involves providing a substrate with tungsten features, a specific polishing composition, and a chemical mechanical polishing pad. The process ensures that some tungsten is polished away while minimizing dishing, which is essential for maintaining the integrity of the features.
Career Highlights: Hsu is currently employed at Rohm and Haas Electronic Materials CMP Holdings, Inc. His work focuses on developing advanced materials and processes that enhance the performance of semiconductor devices. His expertise in chemical mechanical polishing has positioned him as a key player in the industry.
Collaborations: Throughout his career, Syin Hsu has collaborated with talented individuals such as Jia-De Peng and Lin-Chen Ho. These collaborations have fostered innovation and have contributed to the successful development of new technologies in the field.
Conclusion: Syin Hsu's contributions to chemical mechanical polishing represent a significant advancement in semiconductor manufacturing. His innovative methods and collaborative efforts continue to influence the industry positively.