This inventor holds 2 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2017.
Company Filing History:
Years Active: 2014-2017
Title: The Innovations of Sut-I Lo
Introduction
Sut-I Lo is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and methods. With a total of 2 patents to his name, Sut-I Lo continues to push the boundaries of technology.
Latest Patents
One of Sut-I Lo's latest patents focuses on package structures that include a capacitor and methods of forming the same. This patent describes a package that consists of a die, an encapsulant, and a capacitor. The package features a first side and a second side, with the die having corresponding sides that align with these package sides. The encapsulant surrounds the die, while the capacitor includes a first plate and a second plate within the encapsulant. The opposing surfaces of these plates extend from the package's first side to its second side, and external conductive connectors are attached to at least one of the package sides.
Career Highlights
Sut-I Lo is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing packaging technologies that enhance the performance and reliability of electronic devices.
Collaborations
Throughout his career, Sut-I Lo has collaborated with notable colleagues, including Ching-Wen Hsiao and Hsu-Hsien Chen. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Sut-I Lo's contributions to semiconductor packaging exemplify the spirit of innovation in the technology sector. His patents and collaborative efforts continue to influence the industry, paving the way for future advancements.