Tokyo, Japan

Susumu Inakazu


Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: The Innovations of Susumu Inakazu

Introduction

Susumu Inakazu is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing technology. His innovative approach has led to the development of a unique apparatus that enhances the efficiency of wafer division.

Latest Patents

Inakazu holds a patent for a wafer dividing apparatus. This apparatus is designed to divide a wafer that is adhered to an adhesive tape and supported at an opening of a frame into individual chips along a scheduled division line. The invention includes a cassette table that is movable in the Z-axis direction, a carry-out/in unit for handling the frame, and a reversing unit that rotates the frame to reverse its front and back. This innovative design streamlines the wafer division process, making it more efficient and effective.

Career Highlights

Inakazu is currently employed at Disco Corporation, where he continues to work on advancements in wafer processing technology. His expertise and innovative mindset have positioned him as a key player in his field.

Collaborations

Inakazu collaborates with talented individuals such as Takayuki Masada and Yoshihiro Kawaguchi. Their combined efforts contribute to the ongoing development of cutting-edge technologies in the semiconductor industry.

Conclusion

Susumu Inakazu's contributions to wafer processing technology exemplify the spirit of innovation. His patented wafer dividing apparatus showcases his commitment to enhancing efficiency in the industry. Through his work at Disco Corporation and collaborations with skilled colleagues, Inakazu continues to make a significant impact in the field.

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