The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Dec. 03, 2019
Disco Corporation, Tokyo, JP;
Takayuki Masada, Tokyo, JP;
Yoshihiro Kawaguchi, Tokyo, JP;
Tomohito Matsuda, Tokyo, JP;
Yuhei Fujii, Tokyo, JP;
Susumu Inakazu, Tokyo, JP;
Ryota Saito, Tokyo, JP;
Naoya Takesue, Tokyo, JP;
Hideaki Ishida, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A wafer dividing apparatus for dividing a wafer stuck to an adhesive tape and supported at an opening of a frame into individual chips along a scheduled division line is provided. The wafer dividing apparatus includes a cassette table movable upwardly and downwardly in a Z axis direction, a first carry-out/in unit that carries out the frame from the cassette placed on the cassette table or carry in the frame to the cassette, a first temporary receiving unit including a pair of first guide rails extending in the X axis direction and a guide rail opening/closing portion that increases the distance between the pair of first guide rails, a reversing unit including a holding portion that holds the frame and rotates by 180 degrees to reverse the front and back of the frame, and a transport unit that moves the reversed frame.