Kitaibaraki, Japan

Susumi Sawada

This inventor holds 1 USPTO granted patent. Top assignee: Nippon Mining Co., Ltd.. Active years: 1992.


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 36(Granted Patents)


Company Filing History:


Years Active: 1992

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1 patent (USPTO):Explore Patents

Title: Susumi Sawada: Innovator in Thin Film Deposition Technology

Introduction

Susumi Sawada is a notable inventor based in Kitaibaraki, Japan. He has made significant contributions to the field of thin film deposition technology. His innovative approach addresses critical challenges in the manufacturing process, particularly in preventing contamination during vapor growth.

Latest Patents

Sawada holds a patent for a thin film deposition system. This system is designed to prevent contamination of devices and the formation of particles in the deposited thin film. The anti-contamination means includes several options, such as an electrolytic copper foil with a fine-grained thin layer of copper or copper oxide, a corrugated metal foil, and a metal foil with irregularities formed by embossing. This invention enhances the quality and reliability of thin films used in various applications.

Career Highlights

Throughout his career, Sawada has been associated with Nippon Mining Co., Ltd., where he has contributed to advancements in material science and engineering. His work has been instrumental in developing technologies that improve manufacturing processes and product quality.

Collaborations

Sawada has collaborated with notable colleagues, including Osamu Kanou and Hironori Wada. These partnerships have fostered innovation and have led to the successful development of new technologies in their field.

Conclusion

Susumi Sawada's contributions to thin film deposition technology exemplify the importance of innovation in manufacturing. His patent and collaborative efforts continue to influence the industry positively.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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