Potsdam, NY, United States of America

Suryadevera V Babu

This inventor holds 1 USPTO granted patent. Top assignee: Climax Engineered Materials, LLC. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Suryadevera V Babu. Retrieved from https://idiyas.com/inventor/suryadevera-v-babu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Innovations of Suryadevera V Babu

Introduction

Suryadevera V Babu is a notable inventor based in Potsdam, NY (US). He has made significant contributions to the field of chemical mechanical polishing, particularly in the development of polishing slurries.

Latest Patents

Suryadevera V Babu holds a patent for "Polishing slurries and methods for chemical mechanical polishing." This invention focuses on aqueous polishing slurries that are effective for polishing copper at high rates. The slurries include soluble salts of molybdenum and molybdic acid, both dissolved in an oxidizing agent. The methods described in the patent involve polishing copper using low pressures with a polishing pad and these specialized aqueous slurries.

Career Highlights

Suryadevera V Babu is associated with Climax Engineered Materials, LLC, where he applies his expertise in polishing technologies. His work has contributed to advancements in the efficiency and effectiveness of chemical mechanical polishing processes.

Collaborations

He has collaborated with notable coworkers such as Youngki Hong and Udaya B Patri, enhancing the innovation landscape in his field.

Conclusion

Suryadevera V Babu's contributions to polishing technologies exemplify the impact of innovative thinking in engineering. His patent and work at Climax Engineered Materials, LLC highlight the importance of advancements in chemical mechanical polishing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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