The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2007
Filed:
Jan. 11, 2005
Sunil Chandra Jha, Oro Valley, AZ (US);
Sreehari Nimmala, Oro Valley, AZ (US);
Sharath Hegde, Potsdam, NY (US);
Youngki Hong, Potsdam, NY (US);
Suryadevera V. Babu, Potsdam, NY (US);
Udaya B. Patri, Potsdam, NY (US);
Sunil Chandra Jha, Oro Valley, AZ (US);
Sreehari Nimmala, Oro Valley, AZ (US);
Sharath Hegde, Potsdam, NY (US);
Youngki Hong, Potsdam, NY (US);
Suryadevera V. Babu, Potsdam, NY (US);
Udaya B. Patri, Potsdam, NY (US);
Climax Engineered Materials, LLC, Phoenix, AZ (US);
Abstract
Aqueous polishing slurries for chemical-mechanical polishing are effective for polishing copper at high polish rates. The aqueous slurries according to the present invention may include soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent. Methods for polishing copper by chemical-mechanical planarization include polishing copper with low pressures using a polishing pad and a aqueous slurries including soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent, particles of MoOdissolved in an oxidizing agent, and particles of MoOdissolved in an oxidizing agent.