Bengaluru, India

Suprotik Das

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Suprotik Das: Innovator in Hot Melt Adhesive Dispensing Systems

Introduction

Suprotik Das is a notable inventor based in Bengaluru, India. He has made significant contributions to the field of adhesive dispensing technology. His innovative approach has led to the development of a unique system that enhances the efficiency of hot melt adhesive applications.

Latest Patents

Suprotik Das holds a patent for a "System and method for dispensing hot melt adhesives." This invention comprises an adhesive dispenser that includes a fluid passage leading to an outlet. The system is designed with a supply conduit that is fluidly connected to the fluid passage. Additionally, it features a feeding mechanism that is configured to feed an elongate, flexible element of solid adhesive into the supply conduit. A first heating element is strategically positioned along the supply conduit to melt a portion of the solid adhesive, thereby forming a supply of liquid adhesive within the conduit. This innovative design streamlines the adhesive dispensing process, making it more efficient and effective.

Career Highlights

Suprotik Das is currently employed at Nordson Corporation, a leading company in adhesive dispensing solutions. His work at Nordson has allowed him to apply his inventive skills in a practical setting, contributing to advancements in adhesive technology.

Collaborations

Throughout his career, Suprotik has collaborated with talented individuals such as Sheenfar S Fong and Akio Otsuka. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Suprotik Das is a distinguished inventor whose work in hot melt adhesive dispensing systems has made a significant impact in the industry. His patent reflects his commitment to innovation and efficiency in adhesive technology.

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