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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9920222 B1

PDFFull Text
Date of Patent:
Mar. 20, 2018

Filed:

Nov. 03, 2015

System and method for dispensing hot melt adhesives

Applicant:

Nordson Corporation, Westlake, OH (US);

Inventors:

Suprotik Das, Bangalore, IN;

Sheenfar S. Fong, Suwanee, GA (US);

Akio Otsuka, Chiba, JP;

Laurence B. Saidman, Duluth, GA (US);

Assignee:

Nordson Corporation, Westlake, OH (US);

Attorney:

Baker & Hostetler LLP

Primary Examiner:

J Casimer Jacyna

Assistant Examiner:

Benjamin R Shaw

Int. Cl.
CPC ...
B67D 7/80 (2010.01); C09J 5/00 (2006.01); B05C 11/10 (2006.01); B65H 49/26 (2006.01); B65H 51/10 (2006.01); C09J 175/04 (2006.01); C09J 153/02 (2006.01); C09J 153/00 (2006.01); B29B 13/02 (2006.01); C09J 177/00 (2006.01); B05B 9/00 (2006.01); B05C 5/02 (2006.01);
U.S. Cl.
CPC ...
C09J 5/00 (2013.01); B05C 5/0279 (2013.01); B05C 11/1007 (2013.01); B05C 11/1013 (2013.01); B05C 11/1026 (2013.01); B05C 11/1042 (2013.01); B29B 13/022 (2013.01); B65H 49/26 (2013.01); B65H 51/10 (2013.01); C09J 153/00 (2013.01); C09J 153/02 (2013.01); C09J 175/04 (2013.01); C09J 177/00 (2013.01); B05B 9/002 (2013.01); B05C 5/0225 (2013.01); B65H 2404/14 (2013.01); B65H 2515/40 (2013.01); C09J 2201/606 (2013.01); C09J 2201/61 (2013.01); C09J 2400/22 (2013.01); C09J 2453/00 (2013.01); C09J 2475/00 (2013.01);
Abstract

A system for dispensing hot melt adhesives, comprising an adhesive dispenser including a fluid passage leading to an outlet. The system further comprises a supply conduit fluidly connected to the fluid passage and a feeding mechanism configured to feed an elongate, flexible element of solid adhesive into the supply conduit. The system further comprises a first heating element positioned along at least a portion of the supply conduit to melt a portion of the elongate, flexible element being fed into the supply conduit and thereby form a supply of liquid adhesive within the supply conduit.

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