Eagan, MN, United States of America

Sunil K Pillalamarri

USPTO Granted Patents = 4 


 

Average Co-Inventor Count = 1.6

ph-index = 3

Forward Citations = 62(Granted Patents)


Location History:

  • Austin, TX (US) (2010)
  • Eagan, MN (US) (2011 - 2017)

Company Filing History:


Years Active: 2010-2017

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4 patents (USPTO):Explore Patents

Title: Innovations by Sunil K Pillalamarri

Introduction

Sunil K Pillalamarri is a notable inventor based in Eagan, MN (US). He has made significant contributions to the field of temporary wafer bonding, holding a total of 4 patents. His work focuses on developing advanced bonding compositions that enhance the efficiency and effectiveness of semiconductor processing.

Latest Patents

Sunil's latest patents include innovative compositions for high-temperature, spin-on bonding. One of his patents describes new bonding compositions that utilize a polymer dispersed or dissolved in a solvent system. These compositions are designed to bond an active wafer to a carrier wafer, providing protection during processing and handling. The bonding layers formed are both chemically and thermally resistant, yet can be softened to allow for the separation of wafers at the appropriate stage in fabrication. Another patent focuses on high-temperature spin-on temporary bonding compositions, which are thermoplastic and include imides, amideimides, and/or amideimide-siloxanes. These compositions also serve to protect active wafers during subsequent processing.

Career Highlights

Sunil K Pillalamarri is currently employed at Brewer Science, Inc., where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing the methods used in wafer bonding, contributing to the efficiency of semiconductor manufacturing processes.

Collaborations

Sunil collaborates with talented coworkers, including Wenbin Hong and Chenghong Li, who contribute to the development of his innovative bonding compositions.

Conclusion

Sunil K Pillalamarri's contributions to the field of temporary wafer bonding through his patents and work at Brewer Science, Inc. highlight his role as a significant inventor in semiconductor technology. His innovative approaches continue to shape the future of wafer bonding processes.

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