The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Apr. 29, 2010
Applicants:
Sunil K. Pillalamarri, Eagan, MN (US);
Chenghong LI, Cary, NC (US);
Inventors:
Sunil K. Pillalamarri, Eagan, MN (US);
Chenghong Li, Cary, NC (US);
Assignee:
Brewer Science Inc., Rolla, MO (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/00 (2006.01); H01L 21/683 (2006.01); B29B 17/02 (2006.01); B32B 38/10 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B29B 17/02 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); C09J 2205/302 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2924/30105 (2013.01); Y10T 156/11 (2015.01); Y10T 156/1153 (2015.01); Y10T 156/1168 (2015.01); Y10T 156/1189 (2015.01); Y10T 156/19 (2015.01); Y10T 156/1972 (2015.01); Y10T 428/31678 (2015.04);
Abstract
New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.