Location History:
- Rolla, MO (US) (2008)
- Morrisville, NC (US) (2008 - 2012)
- Cary, NC (US) (2012 - 2017)
Company Filing History:
Years Active: 2008-2017
Title: Innovations by Chenghong Li: A Pioneer in Semiconductor Bonding Technologies
Introduction
Chenghong Li, an accomplished inventor based in Morrisville, NC, holds an impressive portfolio of 7 patents. His contributions to the field of microelectronics, particularly in bonding technologies, have significantly advanced the production processes for semiconductor and MEMS devices.
Latest Patents
Two of Chenghong Li's latest patents showcase his innovative spirit and technical expertise. The first patent introduces high-temperature, spin-on bonding compositions for temporary wafer bonding using a sliding approach. This invention outlines new compositions and methods designed to bond an active wafer with a carrier wafer or substrate. These bonding compositions comprise a polymer dispersed or dissolved in a solvent system, enhancing protection for the active wafer during processing and handling. The resulting bonding layers are chemically and thermally resistant, yet engineered to soften and allow wafers to slide apart at the right stage of fabrication.
The second patent presents spin-on protective coatings specifically for wet-etch processing of microelectronic substrates. This invention includes multiple layers: a primer layer comprised of an organo silane compound, a first protective layer of thermoplastic copolymers, and an optional second layer made of a highly halogenated polymer. This advanced structure aids in the production of high-quality semiconductor and MEMS devices.
Career Highlights
Chenghong Li has worked with notable companies such as Brewer Science, Inc. and Arlon, where he has made significant strides in the realm of material science and semiconductor technology. His career reflects a dedication to innovation and excellence in research and development.
Collaborations
Throughout his career, Chenghong has collaborated with esteemed colleagues, including Tony D. Flaim and Kimberly A. Ruben. These partnerships have fostered an environment of creative problem-solving and have contributed to the successful development of his patents.
Conclusion
Chenghong Li's innovative contributions to the field of microelectronics through his patents and collaborative endeavors underscore his role as a leading inventor in semiconductor bonding technologies. His work not only enhances production efficiency but also sets a benchmark for future innovations in the industry.