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Incheon, South Korea

SungYoon Lee

This inventor holds 8 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2010-2015.

USPTO Granted Patents = 8

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 33(Granted Patents)

Location History:

Inchon-si, KR (2010 - 2015)
Kyounggi, KR (2015)

Company Filing History:

Stats Chippac Pte. Ltd.

Years Active: 2010-2015

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9136144 - Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation (2015-09-15),

2. 8994196 - System and method for directional grinding on backside of a semiconductor wafer (2015-03-31),

3. 8704366 - Ultra thin bumped wafer with under-film (2014-04-22),

4. 8329554 - Ultra thin bumped wafer with under-film (2012-12-11),

5. 8030769 - Grooving bumped wafer pre-underfill system (2011-10-04),

6. 7892072 - Method for directional grinding on backside of a semiconductor wafer (2011-02-22),

7. 7838391 - Ultra thin bumped wafer with under-film (2010-11-23),

8. 7727875 - Grooving bumped wafer pre-underfill system (2010-06-01),

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