Company Filing History:
4 out of 131,611 
1 out of 416 
Years Active: 2022-2025
Title: Innovations by Inventor Sunguk Lee
Introduction
Sunguk Lee is a prominent inventor based in Suwon-si, South Korea, known for his significant contributions to the field of semiconductor packaging. With a total of four patents to his name, he continues to advance technology within the industry through innovative solutions and designs.
Latest Patents
Among his notable inventions are patents related to package substrates and semiconductor packages. One of his latest patents focuses on a package substrate that comprises an insulation substrate, at least one redistribution layer (RDL), and a redistribution pad. The RDL is integrated within the insulation substrate, and the redistribution pad extends from the RDL. A unique feature of this invention is the incorporation of segmenting grooves in a radial direction of the redistribution pad, which effectively reduces the area of the pad. This design mitigates physical stress on the package interface die (PID) located above the redistribution pad, substantially decreasing the likelihood of crack generation. Additionally, it prevents the propagation of cracks toward the redistribution pad, thus enhancing the overall reliability of semiconductor packages.
Career Highlights
Sunguk Lee is affiliated with Samsung Electronics Co., Ltd., a global leader in technology and innovation. Throughout his career, he has contributed to numerous advancements in semiconductor technologies, underpinned by his commitment to improving product reliability and performance.
Collaborations
In his professional journey, Sunguk Lee has collaborated with talented individuals such as Youngkyu Lim and Gookmi Song. Together, they have worked on projects that aim to innovate and refine semiconductor package designs, pushing the boundaries of what's possible in the industry.
Conclusion
Sunguk Lee exemplifies the spirit of innovation through his cutting-edge inventions and collaborations. His contributions significantly impact the semiconductor field, illustrating how dedicated inventors can drive technological improvements and enhance product reliability in modern electronics.