Sunghwa Jung

Title: Sunghwa Jung and Semiconductor Chip Molding Innovation.

Introduction

Sunghwa Jung is an inventor based in Suwon-si, South Korea, associated with Samsung Electronics Ltd. His patent work includes a device designed to mold multiple semiconductor chips.

Latest Patents

Jung is credited with 1 patent, titled “Semiconductor Chip Molding Die Device.” The invention describes a die device with a lower die containing a moving plate and V-groove structures that suction a resin-coated release film. An upper die moves toward or away from the lower die to close or open the dies, and includes suction vent units for holding a substrate carrying semiconductor chips. The lower die also provides a mechanism for manually adjusting the tension of a spring supporting the moving plate.

Career Highlights

Jung’s listed patent reflects work on semiconductor packaging equipment, particularly die structures and film handling for molding multiple chips. His association with Samsung Electronics Ltd. connects this invention to the company’s semiconductor technology activities.

Collaborations

Hwansoo Lee and Minsang Park are identified as Jung’s coworkers. The available information does not specify their roles in the patent or whether they collaborated on this invention.

Conclusion

Sunghwa Jung’s patent describes a semiconductor molding die device that combines substrate suction, release-film handling, and adjustable spring tension to support the molding of multiple chips.