The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Aug. 09, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Hwansoo Lee, Suwon-si, KR;
Minsang Park, Suwon-si, KR;
Hoon Chang, Suwon-si, KR;
Byeonggon Kim, Suwon-si, KR;
Sunghwa Jung, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A die device for molding a plurality of semiconductor chips is provided. The die device includes a lower die including a moving plate that has a plurality of V-groove structures for suctioning a release film coated with a resin, and an upper die which descends to the lower die or ascends from the lower die, thereby closing/opening the dies. The upper die includes at least a plurality of suction vent units for suctioning a substrate on which the semiconductor chips are arranged, and the lower die includes a device for manually adjusting the tension of a spring that supports the moving plate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile