This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Byeonggon Kim and Semiconductor Chip Molding Technology.
Introduction
Byeonggon Kim is an inventor based in Suwon, South Korea, and is associated with Samsung Electronics Ltd. His patent work includes a device designed to mold multiple semiconductor chips.
Latest Patents
Kim is listed as an inventor on 1 patent, titled “Semiconductor Chip Molding Die Device.” The invention describes a lower die with a moving plate featuring multiple V-groove structures that suction a resin-coated release film. An upper die moves toward or away from the lower die to close or open the mold, and includes suction vent units for holding a substrate carrying semiconductor chips. The lower die also has a mechanism for manually adjusting the tension of a spring that supports the moving plate.
Career Highlights
Kim’s listed patent reflects work on semiconductor manufacturing equipment, with features intended to hold the release film and substrate during molding and allow adjustment of the moving plate’s spring tension.
Collaborations
The patent lists Minsang Park and Hwansoo Lee among Kim’s coworkers.
Conclusion
Byeonggon Kim’s patent contribution focuses on a semiconductor chip molding die device that combines film and substrate suction with adjustable support for the moving plate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile