Company Filing History:
Years Active: 2016-2018
Title: **Sung Kyu Lim: Innovator in Through-Silicon Via Technologies**
Introduction
Sung Kyu Lim is an influential inventor based in Duluth, GA, recognized for his contributions to the field of integrated circuit technologies. With a total of six patents, Lim has made significant strides in improving the reliability and performance of three-dimensional integrated circuits (3DICs).
Latest Patents
Among his recent inventions, Lim has developed a series of patents focusing on through-silicon via (TSV) crack sensors designed to detect cracks in TSVs within 3DICs. One notable aspect of this technology involves a TSV crack sensor circuit that features doped rings for multiple TSVs interconnected in parallel. This innovative approach allows for simultaneous testing of all interconnected doped rings by introducing a single current into the contacts. Additionally, Lim's patent includes a design for a crack sensor circuit that incorporates redundant TSVs, thus allowing defective TSVs to be replaced with spare TSVs when necessary. This ability to correct compromised 3DICs enhances their functionality and durability.
Another significant patent addresses the power delivery network (PDN) design for monolithic 3D-ICs. This system features a first die in contact with power/ground bumps, while a second die is stacked atop it. To facilitate efficient power delivery to the second die, the design includes bypass power/ground vias and monolithic inter-tier vias (MIVs), creating a robust network for advanced integrated circuit functionality.
Career Highlights
Sung Kyu Lim currently works with Qualcomm Incorporated, a leading technology company where he applies his expertise to drive innovations in semiconductor solutions. His work at Qualcomm has placed him at the forefront of the integrated circuit design, particularly focusing on enhancing the capabilities of 3DICs.
Collaborations
Throughout his career, Lim has collaborated with esteemed colleagues, including Yang Du and Kambiz Samadi. These partnerships have enabled him to expand the impact of his inventions, fostering an environment of innovation and progress within the semiconductor field.
Conclusion
Sung Kyu Lim exemplifies the role of an innovative inventor, pushing the boundaries of what is possible in integrated circuit technology. His latest patents not only address immediate challenges in the industry but also pave the way for future advancements in three-dimensional integrated circuits. Lim's contributions, alongside the collaborative efforts of his talented coworkers, continue to shape the landscape of modern technology.