Sung-jun Im

Title: Innovations by Inventor Sung-jun Im

Introduction

Sung-jun Im is a prolific inventor based in Yongin-si, South Korea, recognized for his significant contributions to the field of semiconductor technology. With a total of five patents to his name, his innovations primarily focus on enhancing the efficiency and performance of semiconductor packages.

Latest Patents

Among his latest patents, Sung-jun Im has developed an advanced method of manufacturing chip-stacked semiconductor packages. This method involves several key steps: preparing a base wafer containing multiple first chips equipped with through-silicon vias (TSV), bonding this base wafer to a supporting carrier, preparing additional second chips, and ultimately forming stacked chips by bonding these second chips to the first chips. The finished product is then sealed with a dedicated sealing portion and separated into individual stacked chips. This innovative approach is pivotal in the ever-evolving semiconductor industry.

Career Highlights

Sung-jun Im's career is notably affiliated with Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung emphasizes the application of cutting-edge technology in developing more efficient and compact semiconductor solutions, further bolstering the company's reputation as an innovator in electronics.

Collaborations

Throughout his career, Sung-jun Im has worked alongside talented professionals, including Dong-hyeon Jang and Teak-Hoon Lee. Collaborating with such esteemed coworkers underscores the dynamic and innovative environment at Samsung, promoting a culture of creativity and technological advancement.

Conclusion

Sung-jun Im exemplifies the spirit of innovation within the semiconductor field. With his continued dedication and impactful patents, he contributes to the ongoing advancement of technology, enhancing the capabilities of semiconductor packaging and driving the industry forward.