Sung-Hua Chung

Title: Innovations by Sung-Hua Chung in Electronic Packaging

Introduction

Sung-Hua Chung is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, particularly with his innovative designs that enhance the functionality and reliability of electronic devices. His work is characterized by a focus on improving the structural integrity of electronic packages.

Latest Patents

Sung-Hua Chung holds a patent for an electronic package that features a unique design. This electronic package includes an electronic structure embedded within an encapsulation layer. A protective layer is formed on top of the encapsulation layer, and an insulating layer is placed on the protective layer. Notably, at least one blind via is created, which penetrates through both the insulating and protective layers. This design allows the electronic structure to be exposed from the blind via, enabling a circuit layer formed on the insulating layer to extend into the blind via for electrical connection. This innovative double-layer design effectively prevents voids generated during the manufacturing process from affecting the insulating layer, thereby ensuring the integrity of the circuit layer.

Career Highlights

Sung-Hua Chung is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to develop cutting-edge technologies in electronic packaging. His expertise in this area has positioned him as a valuable asset to his company and the industry at large.

Collaborations

One of his notable collaborators is Liang-Pin Chen, with whom he has worked on various projects related to electronic packaging innovations.

Conclusion

Sung-Hua Chung's contributions to electronic packaging demonstrate his commitment to advancing technology in this field. His innovative designs not only enhance the performance of electronic devices but also pave the way for future advancements in electronic packaging solutions.