Sung Dong Cho

Title: The Innovative Mind of Sung Dong Cho

Introduction

Sung Dong Cho, an accomplished inventor based in Fishkill, NY, has made significant contributions to the field of semiconductor technology. With a total of three patents to his name, he has showcased his expertise and creativity in developing advanced semiconductor devices.

Latest Patents

Cho's latest patents include a groundbreaking semiconductor device incorporating through-silicon-via (TSV) technology. His invention describes a semiconductor device featuring a substrate with an interlayer insulating layer applied on top. The device includes a first etch stop layer on the substrate and two TSVsone that passes through the substrate and the interlayer insulating layer, and a second TSV that extends through both the substrate and the first etch stop layer. Notably, the second TSV is engineered to have a greater width than the first, enhancing the performance and efficiency of the semiconductor device.

Career Highlights

Throughout his career, Sung Dong Cho has been affiliated with prominent companies in the technology sector. He has worked at Samsung Electronics Co., Ltd. and Infineon Technologies AG, where he honed his skills and contributed to innovative projects that have shaped the industry.

Collaborations

During his tenure in the semiconductor field, Cho has collaborated with talented professionals, including Kwang Wuk Park and Eun Ji Kim. Their collective expertise has undoubtedly fostered a creative environment, leading to advancements in semiconductor technologies.

Conclusion

Sung Dong Cho's contributions to semiconductor innovation through his patents highlight his role as a forward-thinking inventor. With each invention, he pushes the boundaries of technology, demonstrating a commitment to enhancing the field and inspiring future advancements in semiconductor devices.