Greater Noida, India

Sumit Varshney

This inventor holds 1 USPTO granted patent. Top assignee: Nxp B.v.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sumit Varshney. Retrieved from https://idiyas.com/inventor/sumit-varshney-nfa714w1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations by Sumit Varshney in Semiconductor Device Packaging

Introduction

Sumit Varshney is an accomplished inventor based in Greater Noida, India. He has made significant contributions to the field of semiconductor device packaging, focusing on reducing noise effects in electronic signals. His innovative approach has led to the development of a unique mechanism that enhances the performance of semiconductor devices.

Latest Patents

Sumit Varshney holds a patent titled "System and method for reducing mutual coupling for noise reduction in semiconductor device packaging." This invention provides a mechanism to reduce noise effects on signals traversing bond wires of a System on Chip (SoC). The patent describes a bond wire ring structure that decreases mutual inductance and capacitive coupling. By forming a daisy chain connecting isolated ground leads at a semiconductor device package, this structure effectively reduces out-of-plane electromagnetic field interference generated by signals in lead wires, as well as mutual capacitance and mutual inductance. He has 1 patent to his name.

Career Highlights

Sumit Varshney is currently employed at NXP B.V., a leading company in the semiconductor industry. His work focuses on advancing technologies that improve the reliability and efficiency of electronic devices. His expertise in semiconductor packaging has positioned him as a valuable asset in his field.

Collaborations

Throughout his career, Sumit has collaborated with talented professionals, including Ajay Sharma and Rishi Bhooshan. These collaborations have fostered an environment of innovation and creativity, leading to advancements in semiconductor technology.

Conclusion

Sumit Varshney's contributions to semiconductor device packaging demonstrate his commitment to innovation and excellence. His patent for reducing noise effects in electronic signals showcases his ability to address complex challenges in the industry. His work continues to influence the development of more efficient and reliable electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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