The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Feb. 17, 2021
System and method for reducing mutual coupling for noise reduction in semiconductor device packaging
Nxp B.v., Eindhoven, NL;
Ajay Kumar Sharma, Delhi, IN;
Rishi Bhooshan, Uttar Pradesh, IN;
Sumit Varshney, Greater Noida, IN;
Frank Martin Paglia, Georgetown, TX (US);
NXP B.V., Eindhoven, NL;
Abstract
A mechanism is provided to reduce noise effects on signals traversing bond wires of a SOC by forming a bond wire ring structure that decreases mutual inductance and capacitive coupling. Bond wires form the ring structure in a daisy chain connecting isolated ground leads at a semiconductor device package surrounding the semiconductor device. This structure reduces out-of-plane electromagnetic field interference generated by signals in lead wires, as well as mutual capacitance and mutual inductance.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile