Hirakata, Japan

Sumio Sakka

This inventor holds 2 USPTO granted patents. Top assignees: Risho Kogyo Co., Ltd., Tokuyama Soda Kabushiki Kaisha. Active years: 1987-1994.


% Patents Active = 100.0

Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 1987-1994

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2 patents (USPTO):Explore Patents

Title: Sumio Sakka: Innovator in Electronic Sealing Technologies

Introduction

Sumio Sakka is a notable inventor based in Hirakata, Japan. He has made significant contributions to the field of electronic sealing technologies, holding 2 patents that address critical issues in the industry. His work focuses on improving the reliability and performance of electronic components through innovative materials.

Latest Patents

Sakka's latest patents include a tin oxide fiber and a process for producing the same. This invention involves a tin oxide fiber expressed by a specific general formula. Additionally, he developed a resin molding compound for sealing electronic parts. This invention aims to protect electronic components from external circumstances by utilizing synthetic inorganic metal oxides, which are obtained through a meticulous process involving hydrolyzing, drying, pulverizing, and thermally oxidizing purified metal alkoxides. This advancement addresses the issue of radioactive elements in traditional sealing materials, which can adversely affect the performance of electronic parts.

Career Highlights

Throughout his career, Sumio Sakka has worked with prominent companies, including Tokuyama Soda Kabushiki Kaisha and Risho Kogyo Co., Ltd. His experience in these organizations has contributed to his expertise in developing innovative solutions for electronic sealing applications.

Collaborations

Sakka has collaborated with notable coworkers such as Hiroya Yamashita and Keiko Seki. Their combined efforts have furthered advancements in the field of electronic materials and sealing technologies.

Conclusion

Sumio Sakka's contributions to the field of electronic sealing technologies demonstrate his commitment to innovation and improvement. His patents reflect a deep understanding of material science and its application in enhancing the reliability of electronic components.

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