The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 1987
Filed:
Feb. 12, 1986
Yoshifumi Miyake, Hirakata, JP;
Sumio Sakka, Hirakata, JP;
Risho Kogyo Co., Ltd., Osaka, JP;
Abstract
The present invention relates to a resin molding compound for sealing electronic parts. In general, electronic parts are sealed in ceramic packages or synthetic resin molding compounds in order to protect them from an external circumstance in the use thereof. In many cases, materials consisting of synthetic resins and inorganic fillers mainly comprising silicon oxide have been used as sealing materials for synthetic resin molding compounds. However, a defect has occurred in that since an infinitesimal quantity of radioactive elements such as uranium and thorium is contained in inorganic fillers, a memory element in electronic parts produces misactions by alpha-rays radiated from radioactive elements according to circumstances and thereby the fidelity of electronic parts is greatly influenced. The present invention was achieved in order to eliminate this defect and it is an object of the present invention to provide resin molding compounds for sealing electronic parts consisting of synthetic inorganic metal oxides, which are obtained by hydrolyzing, drying, pulverizing and thermally oxidizing purified metal alkoxides having hydrolyzable groups, and synthetic resins.