Company Filing History:
Years Active: 2017-2023
Title: The Innovative Contributions of Sukwon Lee
Introduction
Sukwon Lee is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work is primarily associated with Samsung Electronics Co., Ltd., where he has been instrumental in advancing semiconductor manufacturing processes.
Latest Patents
Sukwon Lee's latest patents focus on the development of a bonding head for a die bonding apparatus. This innovative bonding head includes a head body and a thermal pressurizer mounted on its lower surface. The thermal pressurizer is designed to hold and heat at least one die, featuring a heater with a first heating surface that faces the held surface of the die. Additionally, a thermal compensator is positioned at the outer region of the die, extending downwardly from the lower surface of the head body. This compensator includes at least one thermal compensating block that emits heat from a heating source and faces the side surface of the die held on the thermal pressurizer. These patents represent a significant advancement in the method of manufacturing semiconductor packages.
Career Highlights
Throughout his career, Sukwon Lee has demonstrated a strong commitment to innovation in semiconductor technology. His work at Samsung Electronics Co., Ltd. has positioned him as a key figure in the industry. His patents not only enhance the efficiency of semiconductor manufacturing but also contribute to the overall advancement of technology in this field.
Collaborations
Sukwon Lee has collaborated with notable colleagues, including Sebin Choi and Sunghyup Kim. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Sukwon Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future advancements in semiconductor manufacturing.
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