The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Sep. 14, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-Do, KR;
Inventors:
Ilyoung Han, Uiwang-si, KR;
Kyoungran Kim, Suwon-si, KR;
Donggil Shim, Bucheon-si, KR;
Geunsik Oh, Hwaseong-si, KR;
Youngjoo Lee, Seoul, KR;
Junho Lee, Yongin-si, KR;
Sukwon Lee, Yongin-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/04 (2006.01); H01L 23/00 (2006.01); B23K 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 3/087 (2013.01); B23K 37/04 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/75705 (2013.01);
Abstract
A bonding apparatus of substrate manufacturing equipment includes an upper stage, a lower stage facing the upper stage and which is configure and dedicated to support a processed substrate on which semiconductor chips are stacked (set), and an elevating mechanism for raising the lower stage relative to the upper stage to provide pressure for pressing the substrate and chips towards each other.