Sukhbinder Takhar

Title: Sukhbinder Takhar: Innovator in Die Testing Technology

Introduction

Sukhbinder Takhar is an accomplished inventor based in Portland, OR (US). She has made significant contributions to the field of integrated circuit technology, particularly in die testing. Her innovative approach has led to the development of a unique patent that enhances the efficiency of die testing processes.

Latest Patents

Sukhbinder Takhar holds a patent titled "Die stack override for die testing." This patent discloses structures and techniques for exposing circuitry in die testing. In some embodiments, an integrated circuit (IC) die may include first conductive contacts at a first face of the die, second conductive contacts at a second face of the die, die stack emulation circuitry, other circuitry, and a switch. The switch is designed to couple the second conductive contacts to the other circuitry when in a first state, and to couple the die stack emulation circuitry to the other circuitry when in a second state different from the first state. This innovation represents a significant advancement in the field.

Career Highlights

Sukhbinder Takhar is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. Her work at Intel has allowed her to collaborate with some of the brightest minds in the industry, further enhancing her expertise and contributions to technology.

Collaborations

Sukhbinder has worked alongside talented colleagues, including Terrence Huat Hin Tan and Rehan M Sheikh. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Sukhbinder Takhar's contributions to die testing technology exemplify her dedication to innovation in the field of integrated circuits. Her patent and work at Intel Corporation highlight her role as a key player in advancing technology.