Changwon, South Korea

Suk Su Bae

This inventor holds 4 USPTO granted patents. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2004-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Suk Su Bae. Retrieved from https://idiyas.com/inventor/suk-su-bae

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 98(Granted Patents)


Company Filing History:


Years Active: 2004-2007

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4 patents (USPTO):Explore Patents

Title: The Innovations of Suk Su Bae

Introduction

Suk Su Bae is a notable inventor based in Changwon, South Korea. He has made significant contributions to the field of electronics, particularly in the development of chip scale packages. With a total of 4 patents to his name, Bae's work has had a considerable impact on the industry.

Latest Patents

One of Suk Su Bae's latest patents is focused on a chip scale package and the method of fabricating the same. This innovation discloses a chip scale package that comprises conductive layers with a designated depth formed on both the upper and lower surfaces of a chip. Additionally, electrode surfaces are formed on the side surfaces of the conductive layers, which connect to corresponding connection pads of a printed circuit board. This design allows for a miniaturized overall package size. Furthermore, the method of fabricating this chip scale package eliminates the need for a wire-bonding step or a via hole forming step, thereby simplifying the fabrication process and enhancing the reliability of the package.

Another patent by Bae also pertains to a chip scale package. This design features an insulating layer on the upper surface of a chip that has multiple terminals. A plurality of conductive layers is formed on the insulating layer, spaced apart to connect to each terminal. Additionally, electrode surface layers are formed on the upper surfaces of these conductive layers, further advancing the technology in chip packaging.

Career Highlights

Suk Su Bae is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of electronic components, particularly in the realm of miniaturization and reliability.

Collaborations

Throughout his career, Bae has collaborated with several talented individuals, including Yong Chil Choi and Joon Ho Yoon. These collaborations have fostered a creative environment that has led to numerous advancements in their field.

Conclusion

Suk Su Bae's contributions to the field of electronics, particularly through his innovative chip scale packages, demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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