Suk Jin Jung

Title: Suk Jin Jung - Innovator in Wafer Polishing Technology

Introduction

Suk Jin Jung is a notable inventor based in Gumi-si, South Korea. He has made significant contributions to the field of wafer polishing technology, holding two patents that enhance the efficiency and accuracy of wafer processing.

Latest Patents

His latest patents include a "Polishing measurement device and abrasion time controlling method thereof" and a "Polishing control system including same." These inventions provide mechanisms for computing the thickness of a scanned wafer shape to determine a profile. They also compute a delta correction value and a polishing end point time by using a computed PV value based on the profile and a set predicted PV value. This innovation allows for excellent flatness of a wafer surface and enables simultaneous control of multiple controllers, thereby reducing equipment costs. Another patent, the "Wafer carrier thickness measuring device," relates to accurately measuring the inner and outer circumferential thickness of a wafer carrier in a non-contact manner. This device includes a first table capable of rotating and moving vertically, a second table for supporting the outer circumferential portion, and sensors for calculating the thickness of the wafer carrier.

Career Highlights

Suk Jin Jung is currently employed at SK Siltron Co., Ltd., a company recognized for its advancements in semiconductor materials. His work focuses on developing innovative solutions that improve wafer processing techniques.

Collaborations

He collaborates with Kee Yun Han, a talented coworker who contributes to their shared projects in wafer technology.

Conclusion

Suk Jin Jung's inventions and contributions to wafer polishing technology demonstrate his commitment to innovation in the semiconductor industry. His work continues to influence advancements in the field, showcasing the importance of precision and efficiency in manufacturing processes.