The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Jan. 11, 2017
Applicant:
SK Siltron Co., Ltd., Gumi-si, KR;
Inventors:
Kee Yun Han, Gumi-si, KR;
Suk Jin Jung, Gumi-si, KR;
Assignee:
SK Siltron Co., Ltd., Gumi-Si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); B24B 49/02 (2006.01); B24B 49/04 (2006.01); B24B 49/12 (2006.01); B24B 37/16 (2012.01); B24B 37/04 (2012.01); B24B 7/22 (2006.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 7/228 (2013.01); B24B 37/042 (2013.01); B24B 37/16 (2013.01); B24B 49/02 (2013.01); B24B 49/04 (2013.01); B24B 49/12 (2013.01);
Abstract
The present embodiments provide a mechanism for computing a thickness of a scanned wafer shape to determine a profile, and computing a delta correction value and a polishing end point time by using a computed PV value by the profile and a set predicted PV value and reflecting the same on the polishing time of each wafer which is under polishing. Accordingly, excellent flatness of a wafer surface can be achieved and simultaneously, a plurality of controllers can be controlled simultaneously to reduce equipment cost.