Suhairi Mohmad

Title: The Innovative Contributions of Suhairi Mohmad

Introduction

Suhairi Mohmad is a notable inventor based in Kuala Lumpur, Malaysia. He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique patent that enhances the efficiency and functionality of electronic devices.

Latest Patents

Suhairi holds a patent for an "Integrated circuit package system using etched leadframe." This invention includes a conductive substrate with a heat sink and a plurality of leads etched into the substrate. The design defines a conductive film that connects the heat sink and the leads, maintaining their spatial relationship. A die is attached to the heat sink and wire bonded to the leads. An encapsulant is formed over the die, heat sink, and leads. The conductive film is then etched away to expose the encapsulant and the bottom surfaces of the heat sink and leads. Wave soldering is utilized to form solder on the leads, and the system allows for multiple heat sinks and hanging leads.

Career Highlights

Suhairi Mohmad is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of integrated circuits. His work has been instrumental in advancing packaging technologies that are crucial for modern electronics.

Collaborations

Suhairi has collaborated with talented coworkers, including You Yang Ong and Cheong Chiang Ng, who contribute to the dynamic environment of innovation at Stats Chippac Pte. Ltd.

Conclusion

Suhairi Mohmad's contributions to integrated circuit packaging exemplify the spirit of innovation in technology. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving electronic systems.