Osaka, Japan

Suguru Hashidate

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignees: Kansai University, Osaka Soda Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Suguru Hashidate. Retrieved from https://idiyas.com/inventor/suguru-hashidate

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Suguru Hashidate - Innovator in Electrically Conductive Adhesives

Introduction

Suguru Hashidate is an inventor based in Osaka-shi, Osaka, Japan. He has made significant contributions to the field of electrically conductive adhesives. His innovative approach focuses on creating materials that enhance electronic components.

Latest Patent Applications

Suguru Hashidate has filed a patent application for a novel electrically conductive adhesive. This adhesive is designed to yield a sintered body with low resistivity, despite containing a thermosetting resin along with silver particles. The application details the composition of the adhesive, which includes silver particles coated with a protective layer containing a specific compound. This compound is represented by a general formula where R is an alkyl group with 1-5 carbon atoms, and R can be either a hydrogen atom or another alkyl group with 1-5 carbon atoms.

Conclusion

Suguru Hashidate's work in developing advanced electrically conductive adhesives showcases his innovative spirit and dedication to enhancing electronic components. His contributions are poised to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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