The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Feb. 14, 2022
The School Corporation Kansai University, Suita, JP;
Osaka Soda Co., Ltd., Osaka, JP;
Hideya Kawasaki, Suita, JP;
Suguru Hashidate, Osaka, JP;
Ryo Katou, Osaka, JP;
Takamichi Mori, Osaka, JP;
Junichiro Minami, Osaka, JP;
The School Corporation Kansai University, Suita, JP;
Osaka Soda Co., Ltd., Osaka, JP;
Abstract
Provided is a novel electrically conductive adhesive which can yield a sintered body having low resistivity despite containing a thermosetting resin in addition to silver particles. This electrically conductive adhesive contains silver particles and a thermosetting resin. The silver particles are provided with a protective layer that contains a compound represented by general formula (1). [In general formula (1), Ris an alkyl group having 1-5 carbon atoms, and Ris a hydrogen atom or an alkyl group having 1-5 carbon atoms.]